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公司信息及水印
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牌号简介 About |
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20-2175是一种双组分绝缘封装化合物。该产品具有独特的流动和流变特性,允许用传统材料泄漏的小孔填充空腔。20-2175用于封装电缆端部组件、水密电气连接器、电缆、印刷电路和其他电气组件。它提供了一个快速凝胶,防止过多的流动。特点:卓越的环保性能,控制流量,易于混合,可用于Triggerbond墨盒 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end assemblies, watertight electrical connectors, cables, printed circuitry, and other electrical components. It provides a quick gel to prevent too much flow. Features: Outstanding environmental performance Controlled flow Easy Mixing Available in Triggerbond® Cartridges |
技术参数 Technical Data | |||
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热性能 THERMAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
导热系数 Thermal conductivity coefficient |
0.25 | W/m/K | |
电气性能 Electrical performance |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
绝缘电阻 insulation resistance |
2.0E-11 | ohms | |
Uncured Properties Uncured Properties |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
颜色 colour |
Black | ||
重量混合比(PBW) Weight Mix Ratio (PBW) |
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Part A Part A |
90 | ||
Part B Part B |
100 | ||
体积混合比(PBV) Volume Mixing Ratio (PBV) |
|||
Part A Part A |
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Part B Part B |
|||
密度 Density |
|||
25℃ 25℃ 2 |
g/cm³ | ||
25℃ 25℃ 3 |
g/cm³ | ||
粘度 viscosity |
|||
25℃ 25℃ 2 |
Pa·s | ||
25℃ 25℃ 3 |
Pa·s | ||
固化时间 Curing time |
|||
25℃ 25℃ |
hr | ||
胶凝时间 Gelation time |
|||
25℃ 25℃ |
min | ||
储存稳定性 storage stability |
|||
25 ℃ 25 ℃ |
min | ||
贮藏期限 Storage period |
month | ||
Cured Properties Cured Properties |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
邵氏硬度 Shore hardness |
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邵氏 D Shaw's D |
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耐电强度 Electrical strength |
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3.18 mm 3.18 mm |
kV/mm | ||
1.59 mm 1.59 mm |
kV/mm |
备注 |
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1 一般属性:这些不能被视为规格。 |
2 Part B |
3 Part A |
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