FM® 680-2
PI & 美国氰特
SKYBOND® 7621
PI & 美国Industrial Summit
牌号信息 |
PI & 美国氰特 指导价格:暂无 塑料库存: 缺货 |
PI & 美国Industrial Summit 指导价格:暂无 塑料库存: 缺货 |
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牌号简介 |
FM® 680-2胶粘剂泡沫是一种缩聚型聚酰亚胺泡沫,用于芯接头和边缘密封应用,预期600°F(316°C)的服务。本产品不含金属填料,可用于需要雷达透明度的场合。FM® 680-2可在350°F(177°C)及以上温度下与复合材料共固化。建议应用:将嵌件或边缘构件的蜂窝芯连接到蜂窝芯的芯部局部加强件上 FM® 680-2 adhesive foam is a condensation-type polyimide foam intended for core splice and edge sealing applications where 600°F (316°C) service is expected. This product does not contain metallic filler and may be used in applications where radar transparency is needed. FM 680-2 is co-curable at temperatures of 350°F (177°C) and above with composite materials. Suggested Applications: Splicing honeycomb core Bonding of inserts or edge members to core Local reinforcement of honeycomb core |
Skybond产品线包括许多可用作制造高热稳定性结构复合材料的基体树脂的产品。基于Skybond树脂系列的复合材料连续使用温度超过600°F,短期性能超过1000°F。预浸料已成功地从所有常见的高性能基板(如E玻璃、高模量碳和石英)制造。Skybond家族开发了两种新型的基体树脂。第一种可以通过RTM成型技术进行加工,使聚酰亚胺树脂具有优异的耐热性。第二类新的Skybond基体树脂是两级固化树脂,当用于预浸料应用时,通过高压釜处理(<0.5%空隙率)结合良好的聚酰亚胺树脂热稳定性来制造极低空隙率的复合材料。 The Skybond® product line encompasses a number of products usable as matrix resins for manufacture of high thermal stability structural composites. Composites based on the Skybond® family of resins have continuous use temperatures in excess of 600° F with short term capability greater than 1000° F. Prepreg has been successfully manufactured from all common high performance substrates, such as, E-glass, high modulus carbon, and quartz. Two new classes of matrix resins have been developed in the Skybond® family. The first can be processed by RTM molding techniques to bring the outstanding thermal resistance of polyimide resins to RTM molded composites. The second new class of Skybond® matrix resins is the two-stage cure resins that when used in prepreg applications allow the manufacture of very low void level composites by autoclave processing (<0.5% voids) combined with excellent thermal stability of polyimide resins. |
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产品描述 | |||
厂家: | 美国氰特 Cytec Industries | 美国Industrial Summit | |
类别: | PI PI | PI PI | |
填料: | |||
用途: | 密封剂,泡沫,结构泡沫,粘合,粘合剂 | 复合 | |
性能特点: | 耐高温,粘结性好 High Heat Resistance,Good bond | 热稳定性好 Heat Stabilized | |
加工条件: |
备注 |
1 一般属性:这些不能被视为规格。
2 Cured
3 Uncured
4 Tube Shear
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1 一般属性:这些不能被视为规格。
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价格走势对比图
PI FM® 680-2
PI SKYBOND® 7621
型号 | 类别 | 厂家 | 产地 | 颜色 | 首期使用量 | 后期使用量 | 包装 | 交期 | 成型产品 | 操作 |
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GP-525N | GPPS | VATAA土耳其地区 | 亚太地区 | 天 |
单据状态:未提交