环氧树脂，Plaskon 3400-2对比环氧树脂，Plaskon 3400F-14物性表,价格行情_搜料

牌号信息	Plaskon 3400-2 物性表环氧树脂 & 美国Cookson Electronics 指导价格：暂无塑料库存：缺货	Plaskon 3400F-14 物性表环氧树脂 & 美国Cookson Electronics 指导价格：暂无塑料库存：缺货
牌号简介	该材料是一种低应力环氧模塑料，用于封装各种半导体器件，从小的引线数量下降到中等的引线数量PLCC、QFPS和SOIC。它是为平衡最终用途而特别开发的。 This material is a reduced-stress epoxy molding compound for the enapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs, QFPs and SOICs. It was especially developed for balanced end use properties.	该材料是一种快速固化、低应力环氧模塑料，用于封装半导体器件，包括DIP、PLCC、SOIC和中等铅计数QFP。它是用细颗粒填料开发的，特别是与自动化或传统的成型设备一起使用，并提供了最终使用性能的平衡。 This material is a fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. It was developed with fine filler particles especially for use with automated or conventional molding equipment and offers a balance of end use properties.

产品描述
厂家：	美国Cookson Electronics	美国Cookson Electronics
类别：	环氧树脂环氧树脂	环氧树脂环氧树脂
填料：
用途：
性能特点：	易加工,表面光泽度好,导电,激光加工-标记,防火阻燃等级V-0 Excellent Processability,Good surface appearance,Conductive,Laser engraving,V-0	易加工,表面光泽度好,导电,成型周期快,激光加工-标记,快速固化,防火阻燃等级V-0 Excellent Processability,Good surface appearance,Conductive,Quick molding cycle,Laser engraving,Fast Cure,V-0
加工条件：	树脂传递成型	树脂传递成型