环氧树脂，Plaskon SMT-B-2对比环氧树脂，Plaskon SMT-B-1物性表,价格行情_搜料

牌号信息	Plaskon SMT-B-2 物性表环氧树脂 & 美国Cookson Electronics 指导价格：暂无塑料库存：缺货	Plaskon SMT-B-1 物性表环氧树脂 & 美国Cookson Electronics 指导价格：暂无塑料库存：缺货
牌号简介	这种材料是一种用于高温无铅回流焊的环氧树脂模塑料。它的设计能够承受更高的湿度要求，这是由于处理无铅包装所需的更高的红外回流温度。它是一种高度填充的多功能树脂，设计用于在260°C的红外回流温度下通过JEDEC 3级。 This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 260°C IR reflow temperatures.	这种材料是一种专为网格阵列（BGA/LGA）设计的环氧树脂模塑料。它采用独特的树脂系统，最大限度地减少翘曲，并能在刚性和柔性层压基板上实现无故障成型。成型、后烘烤和随后的焊接处理后的最小尺寸变化使该化合物成为网格阵列的最佳选择。 This material is an epoxy molding compound designed specifically for grid arrays (BGA/LGA). It is formulated with a unique resin system, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid arrays.

产品描述
厂家：	美国Cookson Electronics	美国Cookson Electronics
类别：	环氧树脂环氧树脂	环氧树脂环氧树脂
填料：
用途：
性能特点：	易加工,导电,耐高温,无铅,低吸湿性,快速固化,防火阻燃等级V-0 Excellent Processability,Conductive,High Heat Resistance,Lead content is low to none,Low moisture absorption,Fast Cure,V-0	机械强度好,低翘曲性,尺寸稳定性好,导电,防火阻燃等级V-0 Good Rigidity,Low warping,Good Dimensional Stability,Conductive,V-0
加工条件：	树脂传递成型	树脂传递成型