牌号简介 About |
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EPO-TEK® H20E是一种双组分、100%固体银填充环氧树脂系统,专为微电子和光电应用中的芯片键合而设计。由于其高导热性,它也被广泛用于热管理应用。经过多年的使用证明,它非常可靠,仍然是新应用的导电粘合剂的首选。也可在单组分冷冻注射器中使用。 EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe. |
技术参数 Technical Data | |||
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物理性能 PHYSICAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
颗粒大小 Particle size |
< 45.0 | µm | |
离子类型 Ionic type |
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Cl- Cl- |
73 | ppm | |
K+ K+ |
3 | ppm | |
Na+ Na+ |
2 | ppm | |
NH4+ NH4+ |
98 | ppm | |
补充信息 Supplementary information |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
Degradation Temperature Degradation Temperature |
℃ | TGA | |
Die Shear Strength(>10 kg,23℃) Die Shear Strength(>10 kg,23℃) |
MPa | ||
工作温度 working temperature |
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Continuous Continuous |
℃ | ||
Intermittent Intermittent |
℃ | ||
Storage Modulus(23℃) Storage Modulus(23℃) |
GPa | ||
触变指数 Thixotropic index |
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加热减量 Heating reduction |
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200℃ 200℃ |
% | ||
250℃ 250℃ |
% | ||
300℃ 300℃ |
% | ||
Uncured Properties Uncured Properties |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
颜色 colour |
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-- -- 8 |
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密度 Density |
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Part A Part A |
g/cm³ | ||
Part B Part B |
g/cm³ | ||
粘度 viscosity 9 |
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23℃ 23℃ 9 |
Pa·s | ||
固化时间 Curing time |
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150℃ 150℃ |
hr | ||
储存稳定性 storage stability |
min | ||
Cured Properties Cured Properties |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
邵氏硬度 Shore hardness |
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邵氏 D Shaw's D |
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搭接剪切强度 lap shear strength |
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23℃ 23℃ |
MPa | ||
体积电阻率 Volume resistivity |
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23℃ 23℃ |
ohms·cm | ||
热性能 THERMAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
玻璃化转变温度 Glass transition temperature 2 |
℃ | ||
线性热膨胀系数 Linear coefficient of thermal expansion |
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MD MD |
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-- -- 3 |
cm/cm/℃ | ||
-- -- 4 |
cm/cm/℃ | ||
导热系数 Thermal conductivity coefficient |
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-- -- 5 |
W/m/K | ||
-- -- 6 |
W/m/K | ||
热固组件 Thermosetting components |
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部件 A Component A |
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部件 B Component B |
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贮藏期限 Storage period |
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23℃ 23℃ |
wk |
备注 |
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1 一般属性:这些不能被视为规格。 |
2 Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
3 Below Tg |
4 Above Tg |
5 Based on standard method: Laser Flash |
6 Based on Thermal Resistance Data: R = L x K^-1 x A^-1 |
7 Part B |
8 Part A |
9 100 rpm |
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