环氧树脂，Plaskon MUF-2C对比环氧树脂，Plaskon CMU-870-2C物性表,价格行情_搜料

牌号信息	Plaskon MUF-2C 物性表环氧树脂 & 美国Cookson Electronics 指导价格：暂无塑料库存：缺货	Plaskon CMU-870-2C 物性表环氧树脂 & 美国Cookson Electronics 指导价格：暂无塑料库存：缺货
牌号简介	该材料是一种环氧树脂模底填充化合物，用于将模具设备转移到底填充，并在需要时二次成型，一步翻转封装芯片（FC-BGA和FC-CSP）。与液体封装相比，它提供了自动化、简单、可靠和快速的生产过程。与液体封装材料相比，该材料具有更高的热重、更低的热膨胀系数、无颗粒偏析或沉降以及更长的寿命，从而证明了其更高的可靠性。Plaskon MUF系列是用于倒装芯片封装的全模压底充解决方案。 This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON MUF Series is the total molded underfill solution for Flip Chip in Package.	该材料是一种环氧树脂模底填充化合物，用于将模具设备转移到底填充，并在需要时二次成型，一步翻转封装芯片（FC-BGA和FC-CSP）。与液体封装相比，它提供了自动化、简单、可靠和快速的生产过程。与液体封装材料相比，该材料具有更高的热重、更低的热膨胀系数、无颗粒偏析或沉降以及更长的寿命，从而证明了其更高的可靠性。Plaskon CMU系列是倒装芯片封装的全模压底充解决方案。 This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON CMU Series is the total molded underfill solution for Flip Chip in Package.

产品描述
厂家：	美国Cookson Electronics	美国Cookson Electronics
类别：	环氧树脂环氧树脂	环氧树脂环氧树脂
填料：
用途：
性能特点：	低翘曲性,易加工,导电,防火阻燃等级V-0 Low warping,Excellent Processability,Conductive,V-0	低翘曲性,易加工,导电,防火阻燃等级V-0 Low warping,Excellent Processability,Conductive,V-0
加工条件：	树脂传递成型	树脂传递成型